InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems to be held in San Jose, Texas, United States between 08 October 2024 and 10 October 2024. It is organised by ASME. It covers specific areas of Engineering and Technology such as 0. Visit the website of the conference for more detailed information or contact the organizer for specific questions.
Add to calendar2024-10-082024-10-10Europe/LondonInternational Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystemshttps://www.sciencedz.net/en/conference/106647-international-technical-conference-and-exhibition-on-packaging-and-integration-of-electronic-and-photonic-microsystemsSan Jose, Texas - United StatesASME
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