IMPACT — 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference

IMPACT 2022 Conference, which is organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 26th -28th at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2022. For grasping the latest trend, the symposium highlights the theme “IMPACT on Empowered Edge Computing", which will explore the latest advances, challenges, and hot topics relevant to advanced research in packaging and PCB field.

Topics: Test, Reliability, PCB, Packaging, Thermal, Assembly, Modeling, Heterogeneous integration, green material, IC Substrate, HDI Technology, Interconnections, Nanotechnology