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LTB-3D 2019 — 6th International Workshop on Low Temperature Bonding for 3D Integration
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Organizer :
Topic : Engineering and Technology; 0
Mathematics and Statistics; Engineering and Technology; Keywords: Integration, Manufacturing
Description :
This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems.
LTB-3D 2019 — 6th International Workshop on Low Temperature Bonding for 3D Integration to be held from 21 May 2019 to 25 May 2019 in Kanazawa, Ishikawa-prefecture, Japan. It covers various areas of Engineering and Technology including 0. For more information, visit the website of the conference or contact the organizer.
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Conferences and seminars in JapanConferences and seminars in Japan in 2019
Conferences and seminars in Engineering and Technology
Conferences and seminars in Engineering and Technology in 2019
Conferences and seminars in Engineering and Technology in Japan
Conferences and seminars in Engineering and Technology in Japan in 2019
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