Standing for almost three decades, the IEEE Workshop on Signal and Power Integrity (SPI)
has evolved into a noteworthy forum of exchange on all aspects of
Signal and Power Integrity, comprising the latest research and
developments on design, characterization, modeling, simulation and
testing at chip, package, board, and system level. The workshop brings
together developers and researchers from academia and industry in order
to encourage cooperation.
TOPICS
• Modeling and simulation for SI/PI
• Coupled signal and power integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design