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Thin Wall Packaging North America – 2021
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Topic : Engineering and Technology; Plastic Processing, Composite Materials
Engineering and Technology; Keywords: Plastics, Technology
Description :
The 9th edition of AMI's international Thin Wall Packaging conference covers functionality of plastics materials in protecting and preserving items such as meat, fish, yogurt, fruit and vegetables, dairy and ready meals. It will discuss new applications, technology developments, improved decoration and automation for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry.
Topics: Identifying opportunities and maximizing returns in the lightweight plastic tubs, pots and trays industry
Thin Wall Packaging North America – 2021 to be held in Chicago, IL, United States between 22 June 2021 and 23 June 2021. It is organised by Applied Market Information Ltd – AMI. It covers specific areas of Engineering and Technology such as Plastic Processing, Composite Materials. Visit the website of the conference for more detailed information or contact the organizer for specific questions.
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Conferences and seminars in United States in 2021
Conferences and seminars in Engineering and Technology
Conferences and seminars in Engineering and Technology in 2021
Conferences and seminars in Engineering and Technology in United States
Conferences and seminars in Engineering and Technology in United States in 2021
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