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Multilayer Flexible Packaging North America – 2021
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Topic : Engineering and Technology; Plastic Processing, Composite Materials
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Description :
The program covers the latest material and technological advances in films, raw materials, production techniques and applications that are setting the new standards for flexible packaging excellence in North America and beyond.
Topics: Addressing material and technical innovations in multilayer film to deliver efficient, optimized
Applied Market Information Ltd – AMI organises its event entitled Multilayer Flexible Packaging North America – 2021 to be held from 24 June 2021 to 25 June 2021 in Chicago, IL, United States. It covers various areas of Engineering and Technology including Plastic Processing, Composite Materials. For more information, visit the website of the conference or contact the organizer.
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Conferences and seminars in United States in 2021
Conferences and seminars in Engineering and Technology
Conferences and seminars in Engineering and Technology in 2021
Conferences and seminars in Engineering and Technology in United States
Conferences and seminars in Engineering and Technology in United States in 2021
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