InterPACK 2021 — International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Expired
Dates : 26 October 2021 » 28 October 2021
Place : Online
United States

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Organizer : The American Society of Mechanical Engineers (ASME)
Topic : Chemistry; 0
Mathematics and Statistics; Engineering and Technology; Computer science;
Keywords: Integration, Energy, Manufacturing, Internet of things, Computing, Internet
Description :

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).

Topics: InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles.

InterPACK 2021 — International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems to be held in Online, United States between 26 October 2021 and 28 October 2021. It is organised by The American Society of Mechanical Engineers (ASME). It covers specific areas of Chemistry such as 0. Visit the website of the conference for more detailed information or contact the organizer for specific questions.
Add to calendar 2021-10-26 2021-10-28 Europe/London InterPACK 2021 — International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems https://www.sciencedz.net/en/conference/78112-interpack-2021-international-technical-conference-and-exhibition-on-packaging-and-integration-of-electronic-and-photonic-microsystems Online - United States The American Society of Mechanical Engineers (ASME)
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