International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Dates : 08 outubro 2024 » 10 outubro 2024
Place : San Jose, Texas
Estados Unidos

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Organizer : ASME
Topic : Ciências da Engenharia; 0
Matemática e Estatística; Ciências da Engenharia;
Keywords: Integration, Manufacturing
Description :
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems to be held in San Jose, Texas, Estados Unidos between 08 outubro 2024 and 10 outubro 2024. It is organised by ASME. It covers specific areas of Ciências da Engenharia such as 0. Visit the website of the conference for more detailed information or contact the organizer for specific questions.
Add to calendar 2024-10-08 2024-10-10 Europe/London International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems https://www.sciencedz.net/pt/conference/106647-international-technical-conference-and-exhibition-on-packaging-and-integration-of-electronic-and-photonic-microsystems San Jose, Texas - Estados Unidos ASME
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Conferences and seminars in Texas
Conferences and seminars in Estados Unidos
Conferences and seminars in Estados Unidos in 2024
Conferences and seminars in Ciências da Engenharia
Conferences and seminars in Ciências da Engenharia in 2024
Conferences and seminars in Ciências da Engenharia in Estados Unidos
Conferences and seminars in Ciências da Engenharia in Estados Unidos in 2024
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