LTB-3D 2019 — 6th International Workshop on Low Temperature Bonding for 3D Integration
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Organizer :
Topic : Ciências da Engenharia; 0
Matemática e Estatística; Ciências da Engenharia; Keywords: Integration, Manufacturing
Description :
This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems.
LTB-3D 2019 — 6th International Workshop on Low Temperature Bonding for 3D Integration to be held in Kanazawa, Ishikawa-prefecture, Japão between 21 maio 2019 and 25 maio 2019. It covers specific areas of Ciências da Engenharia such as 0. Visit the website of the conference for more detailed information or contact the organizer for specific questions.
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