Thin Wall Packaging North America – 2021

Expired
Dates : 22 junho 2021 » 23 junho 2021

Place : Chicago, Illinois
Estados Unidos

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Organizer : Applied Market Information Ltd – AMI

Topic : Ciências da Engenharia; Plastic Processing, Composite Materials
Ciências da Engenharia;
Keywords: Plastics, Technology
Description :

The 9th edition of AMI's international Thin Wall Packaging conference covers functionality of plastics materials in protecting and preserving items such as meat, fish, yogurt, fruit and vegetables, dairy and ready meals. It will discuss new applications, technology developments, improved decoration and automation for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry.

Topics: Identifying opportunities and maximizing returns in the lightweight plastic tubs, pots and trays industry


Thin Wall Packaging North America – 2021 to be held in Chicago, IL, Estados Unidos between 22 junho 2021 and 23 junho 2021. It is organised by Applied Market Information Ltd – AMI. It covers specific areas of Ciências da Engenharia such as Plastic Processing, Composite Materials. Visit the website of the conference for more detailed information or contact the organizer for specific questions.
Add to calendar 2021-06-22 2021-06-23 Europe/London Thin Wall Packaging North America – 2021 https://www.sciencedz.net/pt/conference/74299-thin-wall-packaging-north-america-ndash-2021 Chicago, IL - Estados Unidos Applied Market Information Ltd – AMI

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